Chin Tuck Chien
HPC AI Business Solution Manager, Asia, VertivChin Tuck Chien is currently the HPC/AI Business Solutions Manager for Vertiv in the Asia region. In this role, he specializes in the promotion and education of internal and external stakeholders on the latest solutions suitable for high-performance compute and AI applications. He works closely with customers and partners alike through enablement efforts and addressing their technical requirements.
Prior to this role, Tuck was a Senior Product Specialist for High Density and Rack Thermal at Vertiv in Southeast Asia. He provided his product and technical expertise on Vertiv’s portfolio of high density and rack thermal solutions, with a strong focus on high-performance computing and artificial intelligence. He first joined Vertiv in 2019 as a Graduate Engineer, before assuming various technical roles including Application Engineer and Product Engineer for Edge Thermal solutions. He holds a bachelor’s degree in mechanical engineering (Honors) from Monash University in Malaysia.