ZutaCore has launched a new two-phase boiling technology in its coldplate for liquid-cooled IT equipment.

The company recently unveiled Two-Phase Matrix Flow Boiling, the technology inside its OmniTherm family of cold plates.

Built on a manifold that feeds a matrix of boiling regions, the company says the technology can keep the hottest AI chips - and the hot spots shifting within them - at a stable, uniform temperature, within a cold plate thin enough to fit within a single-wide PCIe slot.

ZutaCore said Two-Phase Matrix Flow Boiling brings together the stability of pool boiling with the scalability of flow-boiling. Common headers feed fluid straight down onto many small boiling regions at once, while vapor escapes straight up from each one.

“AI cooling is now an end-to-end system challenge: you have to cool the silicon while keeping entire racks and rows stable,” said My D. Truong, chief product and technology officer at ZutaCore. “Matrix Flow Boiling combines the stability of pool boiling with the scalability of flow boiling, so cooling responds exactly at the location of heat creation. OmniTherm brings that to today’s GPUs, scales to the multi-kilowatt chips on the roadmap, and gives us a scalable technology path into the package and directly to the silicon.”

OmniTherm hybrid copper-aluminum coldplates can be as thin as 11.6 mm and weigh as little as 300g. Deployments are underway this quarter for the Nvidia RTX PRO 6000 Blackwell Server Edition, the company said.

ZutaCore uses closed-loop two-phase cooling; a version of liquid cooling in which the coolant is allowed to boil and condense (changing its phase), removing heat more effectively than simply using heat conduction.

Taiwanese IT infrastructure provider Wiwynn and HVAC firm Carrier are investors in the company. Mitsubishi Electric, Carrier Ventures, and Samsung Electronics invested in the firm earlier this year.