Vertiv has launched a new cooling unit.

The company this week announced the introduction of its new CoolLoop Trim Cooler to support air and liquid cooling applications for AI and HPC deployments.

This solution supports diverse climate conditions for hybrid-cooled or liquid-cooled data centers and 'AI factories,' with Vertiv claiming it offers up to a 70 percent reduction in annual cooling energy consumption via free-cooling and mechanical operation, and 40 percent space savings compared to traditional systems.

Offering cooling capacity up to 2.6MW and 3MW in the air-cooled configuration, the system supports fluctuating supply water temperatures up to 40°C and cold plate functionality at 45°C (104-113°F).

“AI is dramatically changing the cooling profiles of today’s data centers, requiring innovative approaches to managing the thermal challenges inherent in 100kW+ racks,” said Sam Bainborough, vice president, thermal business EMEA at Vertiv.

“Today’s announcement, and the ongoing expansion of Vertiv’s industry-leading high-density thermal management portfolio, allow us to deliver pioneering, future-ready liquid cooling and chilled water solutions to meet our customers’ AI-driven demands.”

The offering can connect directly to immersion cooling systems or integrate with Vertiv’s CoolChip CDU coolant distribution units for direct-to-chip liquid cooling. With free cooling coils optimized for high ambient temperatures, the system is designed to operate in free cooling mode across more seasons and conditions to reduce electrical consumption and CO2e emissions.

The cooler is compliant with the 2027 EU F-GAS regulations ban, using the low-GWP R1234ze refrigerant.

A trim cooler is a water-cooled heat exchanger which is used in addition to an air-cooled heat exchanger.