US electronics manufacturing services and original design manufacturer Flex has acquired liquid cooling business JetCool Technologies.

Terms of the deal were not announced.

JetCool relies on what it calls microconvective direct liquid cooling to cool chips - essentially, instead of passing fluid over a surface, its cooling jets route fluid directly at the surface of a chip.

The approach can allow for high-density cooling and align that cooling to the heat sources on a processor, the company argues. It recently announced a Coolant Distribution Unit (CDU) that can support racks up to 300kW.

"Joining Flex will undoubtedly take JetCool's technologies to new heights through its global presence, extensive manufacturing capabilities and differentiated suite of data center and power offerings," said Dr. Bernie Malouin, CEO, JetCool.

"We look forward to delivering integrated liquid-cooled system and rack solutions with unparalleled efficiency and scale."

JetCool and Flex announced a partnership just last month, with the manufacturing company releasing customizable, open standard-based, compute reference designs integrating JetCool's SmartPlate direct-to-chip liquid cooling solution.

"We are excited to welcome JetCool and their talented team to Flex," said Michael Hartung, president and chief commercial officer at Flex.

"The addition of JetCool's advanced liquid cooling technology strengthens our ability to help customers address increased power, thermal density, and cooling requirements across the full spectrum of AI workloads and high-performance computing for greater performance, efficiency, and sustainability."

Flex expects to integrate the technology into its AI servers, alongside its wider IT and power infrastructure business.

Formerly known as Flextronics, Flex is one of the largest electronics manufacturing services companies in the world, behind Taiwan's Pegatron, with annual revenues of $26.4 billion.