Huawei has reportedly partnered with Wuhan Xinxin Semiconductor Manufacturing to develop high-bandwidth memory (HBM) chips.
China-based Wuhan Xinxin is a semiconductor manufacturer specializing in memory modules, flash memory, and other SPI NOR Flash products.
Citing sources familiar with the situation, South China Morning Post (SCMP) reported that integrated packaging firms Jiangsu Changjiang Electronics Tech and Tongfu Microelectronics are also involved in the project.
Both of those companies will reportedly be providing CoWoS (Chip-on-Wafer-on-Substrate) technology, a packaging process that connects a GPU, a logic chip, and HBM on a special substrate called an interposer.
Neither Huawei nor Wuhan Xinxin responded to SCMP’s request for comment.
HBM is a critical component in AI chips that provides faster processing speeds and reduced power consumption compared to traditional memory. It is believed the move is the latest attempt by Huawei to develop advanced semiconductor technology that current US sanctions prohibit Chinese companies from obtaining.
In April 2024, ASML, the sole supplier of extreme ultraviolet lithography (EUV) photolithography machines – the equipment necessary to produce the most advanced 3nm and 5nm chips – was banned from servicing and maintaining equipment already sold to Chinese customers.
That same month, it was reported that Huawei was building a semiconductor equipment R&D center in Shanghai, with its main focus being on the building of lithography machines. Reports also surfaced around the time that Huawei was leading a group of Chinese firms looking to scale up the domestic production of HBM chips by 2026.
Huawei was first banned from providing equipment to the US government under the Defense Authorization Act of 2018 due to its close links to the Chinese government. A general import ban followed shortly thereafter, with former President Donald Trump signing a law in 2020 to prevent US rural telecom carriers from using Huawei network equipment.
In June, it was reported that the Biden administration was considering limiting exports of high bandwidth memory (HBM) chips to China.
