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Connect | New York // Major Panel: Too cool to commit? Breaking down barriers to liquid cooling adoption

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  • Main Stage
  • Data Center Cooling
  • Open Session
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Speakers

Jacqueline Davis

Research Analyst, Uptime Institute

Jacqueline Davis

Jacqueline Davis

Research Analyst, Uptime Institute

Jacqueline is a Research Analyst at Uptime Institute, focusing on cooling systems, including liquid cooling and its challenges to operations and resiliency. Her background includes environmental monitoring and data interpretation in the environmental compliance and health and safety fields.

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Richard Hallahan

Head of Solutions Engineering, CleanArc Data Centers

Rich Hallahan.jpeg

Richard Hallahan

Head of Solutions Engineering, CleanArc Data Centers

Richard Hallahan is based out of Ashburn, Virginia, United States and works at CleanArc Data Centers as Head of Solutions Engineering.

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Kat Sullivan

Channel Manager, DatacenterDynamics

kat

Kat Sullivan

Channel Manager, DatacenterDynamics

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Peter de Bock

Program Director, ARPA-E, US Department of Energy

Peter De Bock

Peter de Bock

Program Director, ARPA-E, US Department of Energy

Dr. Peter de Bock currently serves as Program Director at the Advanced Research Projects Agency-Energy (ARPA-E) for the US Department of Energy.

At ARPA-E Peter leads and developed the ASCEND and PRE-TRAILS programs to realize a future of sustainable aviation. In addition, Peter developed the COOLERCHIPS program focused on making a transformational leap in efficiency of cooling of Data Centers and manages projects in the areas of ultra-high power density battery systems, hydrogen storage and propulsion, additive manufacturing and power electronics.

Prior to joining ARPA-E, Peter worked at GE Research as Principal Engineer ThermoSciences and platform lead Power-Thermal Mechanical Systems. Peter is the former chair of ASME K-16 committee on Heat Transfer in Electronics equipment, ASME Fellow, AIAA member and holds 50+ patents and publications.

Peter received his Ph.D. in Mechanical Engineering from the University of Cincinnati and holds MSc degrees from University of Twente in the Netherlands, and University of Warwick in the United Kingdom.

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Jason Matteson

Director of Product Management, nVent

Jason Matteson

Jason Matteson

Director of Product Management, nVent

Jason Matteson is a cooling solutions specialist. He has worked in the data center industry for 28 years, currently acting as Global Director of Product Management at nVent in the Data Solutions Group.  

Prior to joining nVent, Jason worked at IBM, Lenovo, Vertiv and most recently Iceotope Technologies. At IBM, he was the principal cooling architect and design engineer for many mission-critical Intel based server programs. At Lenovo, Jason worked in the research and technology lab responsible for identifying and driving disruptive and differentiating technologies. At Vertiv, Jason worked with both the embedded applications and Liebert cooling teams, defining, and driving deeper levels of server integration and deployment offerings. Finally, at Iceotope, Jason was the VP of Solutions Architecture and Director of Product Strategy driving product offerings and customer engagements with new and innovative chassis level liquid cooling technologies.    

In addition to development roles, Jason has, and continues to contribute to several industry consortiums, including ASHRAE and OCP. His roles within ASHRAE TC9.9 include being a current voting member, IT subcommittee member, and previous chair. He is also a contributing and voting member of SPC-127. 

Jason has over 100 U.S. Patents, has authored or co-authored several intellectual-property publications, and has given several presentations about industry power and cooling trends at various technical symposiums and conferences. Jason received a Bachelor of Science degree in mechanical Engineering from Rochester Institute of Technology in 1997. 

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Jerrod Buterbaugh

PMTS - Data Center Thermal and Power Architecture, AMD

Jerrod Buterbaugh

Jerrod Buterbaugh

PMTS - Data Center Thermal and Power Architecture, AMD

Jerrod Buterbaugh serves as a Principal Engineer in AMD’s Datacenter and Embedded Solutions Group, where he specializes in data center power and cooling infrastructure, with a focus on high-density, liquid-cooled computing systems. Jerrod began his career in the United States Air Force as an Avionics and Electrical Technician before moving into the tech industry. He spent 15 years at IBM, developing expertise in server power systems design and data center power and cooling engineering. Following IBM, Jerrod spent 10 years at Lenovo and was instrumental in advancing cooling technologies and services, particularly in energy efficient facility design and deployment of direct liquid cooled servers. Jerrod joined AMD in 2024 and guides AMD’s data center power and cooling infrastructure strategy and supports industry initiatives around high density, liquid-cooled GPU platforms. Jerrod has 24 patents in power and cooling technology and is a member of Open Compute Project and ASHRAE TC9.9, contributing to industry standards. Jerrod holds a B.S. in Electrical Engineering from the University of Florida.

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As the ascent of liquid cooling reshapes the cooling landscape, the conversation has shifted from 'if' to 'when'. Yet, with organizations slow to embrace this transformative technology, questions remain. Is the sheer variety of liquid cooling solutions, such as cold plate, immersion, and GPU-specific designs, creating decision paralysis? Are alternatives being overlooked in the race to redefine efficiency? Could pay-as-you-go models like 'Cooling as a Service' be the key to bridging adoption gaps? This panel will address the hurdles slowing adoption, the impact on the broader industry, and the innovative business models that could drive change. Join us to listen about:

  • Industry indecisiveness: Unpacking the challenges slowing adoption and its ripple effects on industry progress.
  • Cooling as a Service: Exploring how CaaS can reduce energy consumption and operational costs.
  • Overwhelmed by options: Is the abundance of liquid cooling designs a help or hindrance to decision-making?