The evolving standards for direct liquid to chip cooling in the time of AI

AI requirements have accelerated the adoption rate of direct liquid to chip cooling technologies.  Standards and best practices are rapidly being developed to meet the new needs.  This presentation will look at the latest operational requirements from ASHRAE as well as the server and chip manufacturers.  We will discuss technical cooling system temperatures envelopes and chemistry requirements as well as the ongoing effort to develop a standard method of test for rating of coolant distribution units.

Join our hosts and your peers from across the industry for a sit-down, 3-course lunch focused on the future of data center cooling and the challenges and opportunities ahead.

This session is by invitation only