Advancing AI Infrastructure for Liquid: Modular TCS Solutions from The Open Compute Project

Join the Open Compute Project for an in-depth workshop that explores the intersection of artificial intelligence growth and innovative liquid cooling solutions. This session will focus on Modular Technology Cooling Systems (TCS) and their critical role in the evolving landscape of data centers.

Part 1 | Modular TCS Design & Delivery

• Overview of Modular TCS @ CloudScale Workstream
• Key Benefits for Modular TCS Design & Delivery
• Requirements for Modularity in TCS Pipe Systems
• Considerations for TCS Module Sizing
• Branch Line Considerations – A Balancing Discussion

Part 2 | Reliability & Risk Management in TCS Systems

• Reliability & Risk Considerations in TCS Pipe Systems
• Program Controls: Alignment of Module Delivery with System Defect Reduction (Six Sigma)
• Structural Considerations for Deployment of TCS Modules
• Commissioning Considerations: Fabrication, Construction, Maintenance

Part 3 | Learning Outcomes

Participants will leave with a comprehensive understanding of:

• Best practices for designing and implementing modular TCS.
• Insights into managing risks and enhancing reliability in liquid cooling systems.
• Strategies for effective commissioning and maintenance of TCS modules.

This workshop is aimed at data center engineers, facility managers, AI infrastructure developers, and anyone interested in the future of liquid cooling technologies in data centers.

This Co-located Member Workshop, hosted by the Open Compute Project Foundation, will be held during Day Two of DCD>Connect. Join the Open Compute Project Foundation Member Community to discuss the latest topics within the digital infrastructure industry.